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VN808CM-32-E
Octal channel high side driver
Features
Type VN808CM-32-E

RDS(on) 160 m
Iout 1A
VCC 45 V
CMOS compatible input Junction over-temperature protection Case over-temperature protection for thermal independence of the channels Current limitation Shorted load protection Undervoltage shut-down Protection against loss of ground Very low stand-by current Compliance to 61000-4-4 IEC test up to 4 kV
PowerSO-36
It can be driven by using a 3.3 V logic supply. Active current limitation combined with thermal shutdown and automatic restart, protect the device against overload. In overload condition, channel turns OFF and back ON automatically so as to maintain junction temperature between TTSD and TR. If this condition makes case temperature reach TCSD, overloaded channel is turned OFF and will restart only when case temperature has decreased down to TCR(see waveform 3 Figure 6 on page 10). Non overloaded channels continue to operate normally. Device automatically turns OFF in case of ground pin disconnection. This device is especially suitable for industrial applications conform to IEC 61131
Description
The VN808CM-32-E is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground. Figure 1. Block diagram
August 2008
Rev 2
1/18
www.st.com 18
Contents
VN808CM-32-E
Contents
1 2 3 4 5 6 7 8 9 10 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current, voltage conventions and truth table . . . . . . . . . . . . . . . . . . . . . 8 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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VN808CM-32-E
Maximum ratings
1
Maximum ratings
Table 1.
Symbol VCC -IGND IOUT -IOUT IIN VESD PTOT LMAX TJ TC TSTG DC supply voltage DC ground pin reverse current TRAN ground pin reverse current (pulse duration < 1ms) DC output current Reverse DC output current DC Input current Electrostatic discharge (R = 1.5 k; C = 100 pF) Power dissipation at Tc = 25 C Max inductive load (VCC = 24 V, RLOAD = 48 , TA = 100 C) Junction operating temperature Case operating temperature Storage temperature
Absolute maximum rating
Parameter Value 45 -250 -6 Internally limited -2 10 2000 96 2 Internally limited Internally limited -40 to 150 Unit V mA A A A mA V W H C C C
Table 2.
Symbol RthJC RthJA
Thermal data
Parameter Thermal resistance junction-case Thermal resistance junction-ambient
(1)
Value Max Max 1.3 50
Unit C/W C/W
1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 m think) connected to all TAB pins.
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Electrical characteristics
VN808CM-32-E
2
Electrical characteristics
(10.5 V < VCC < 32 V; -40 C < TJ < 125 C; unless otherwise specified) Table 3.
Symbol VCC VUSD RON
Power section
Parameter Operating supply voltage Undervoltage shutdown On state resistance IOUT = 0.5 A; TJ = 25 C IOUT = 0.5 A; OFF state; VCC = 24 V; TCASE = 25 C ON state (all channels ON); VCC = 24 V, TCASE = 100 C VCC = VSTAT = VIN = VGND = 24 V VOUT = 0 V VIN = VOUT = 0 V; VIN = 0 V, IOUT = 0 A Figure 7 on page 12 1 0 Test conditions Min 10.5 7 Typ Max 45 10.5 160 280 150 12 Unit V V m m A mA
IS
Supply current
ILGND IL(off) VOUT(off) td(Vccon)
Output current at turn-off OFF state output current OFF state output voltage Power-on delay time from VCC rising edge
1 5 3
mA A V ms
Table 4.
Symbol tON tOFF
Switching (VCC = 24 V)
Parameter Turn-on time Turn-off time Test conditions RL = 48 from 80 % VOUT Figure 4. RL = 48 to 10 % VOUT Figure 4. RL = 48 from VOUT = 2.4 V to VOUT = 19.2 V Figure 4. RL = 48 from VOUT = 21.6 V to VOUT = 2.4 V Figure 4. Min Typ 50 75 0.7 1.5 Max 100 150 Unit s s V/s V/s
dVOUT/dt(on) Turn-on voltage slope
dVOUT/dt(off) Turn-off voltage slope
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VN808CM-32-E
Electrical characteristics
Table 5.
Symbol VINL IINL VINH IINH VI(HYST) VICL
Input pin
Parameter Input low level Low level input current Input high level High level input current Input hysteresis voltage Input clamp voltage IIN = 1 mA IIN = -1 mA VIN = 2.25 V 0.25 6.0 6.8 -0.7 8.0 VIN = 1.25 V 1 2.25 10 Test conditions Min Typ Max 1.25 Unit V V V V V
Table 6.
Symbol TCSD TCR TCHYST TTSD TR THYST Ilim Vdemag
Protections
Parameter Case shut-down temperature Case reset temperature Case thermal hysteresis Junction shutdown temperature Junction reset temperature Junction thermal hysteresis DC Short circuit current VCC = 24 V; RLOAD = 10 m Test conditions Min 125 110 Typ 130 Max 135 Unit C C
7 150 135 7 1
15 175 200
C C C
15 1.7
C A V
Turn-off output clamp IOUT = 0.5 A; L = 6 mH voltage
VCC-57 VCC-52 VCC-47
Table 7.
Symbol IHSTAT ILSTAT VCLSTAT
Status pin
Parameter High level output current Leakage current Clamp voltage Test conditions VCC = 18...32 V; RSTAT = 1 k (Fault condition) Normal operation; VCC = 32 V ISTAT = 1 mA ISTAT = -1 mA 6.0 6.8 -0.7 Min 2 Typ 3 Max 4 0.1 8.0 Unit mA A V V
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Pin connections
VN808CM-32-E
3
Pin connections
Figure 2. Connection diagram (top view)
Table 8.
Pin N TAB 1 2,3,4,5 6 7 8 9 10 11 12 13
Pin functions
Symbol VCC VCC NC Input 1 Input 2 Input 3 Input 4 Input 5 Input 6 Input 7 Input 8 NC GND STATUS Output 8 Output 7 Function Positive power supply voltage Positive power supply voltage Not connected Input of channel 1 Input of channel 2 Input of channel 3 Input of channel 4 Input of channel 5 Input of channel 6 Input of channel 7 Input of channel 8 Not connected Logic ground Common open source diagnostic for over-temperature High-side output of channel 8 High-side output of channel 7
14,15,16,17,18 19 20 21,22 23,24
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VN808CM-32-E Table 8.
Pin N 25,26 27.28 29,30 31,32 33,34 35,36
Pin connections Pin functions (continued)
Symbol Output 6 Output 5 Output 4 Output 3 Output 2 Output 1 Function High-side output of channel 6 High-side output of channel 5 High-side output of channel 4 High-side output of channel 3 High-side output of channel 2 High-side output of channel 1
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Current, voltage conventions and truth table
VN808CM-32-E
4
Current, voltage conventions and truth table
Figure 3. Current and voltage conventions
Table 9.
Truth table
Conditions INPUTn L H L H L H L H OUTPUTn L H L X L L L L STATUS L L L L L H X X
Normal operation Current limitation Overtemperature (see waveforms 3, 4 Figure 6) -> TJ > TTSD Undervoltage
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VN808CM-32-E
Switching time waveforms
5
Switching time waveforms
Figure 4. Turn-ON and turn-OFF
Figure 5.
VCC turn-ON
9/18
Switching time waveforms Figure 6. Waveforms
VN808CM-32-E
10/18
VN808CM-32-E Figure 6. Waveforms (continued)
Switching time waveforms
11/18
Application schematic
VN808CM-32-E
6
Figure 7.
Application schematic
Application schematic
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VN808CM-32-E
Reverse polarity protection
7
Reverse polarity protection
A schematic solution to protect the IC against a reverse polarity condition is proposed. This schematic is effective with any type of load connected to the outputs of the IC. The RGND resistor value can be selected according to the following conditions to be met: 1. 2. RGND 600 mV / (IS in ON state max). RGND (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. The power dissipation associated to RGNG during reverse polarity condition is: PD = (-VCC)2/RGND This resistor can be shared by several different ICs. In such case IS value on formula (1) is the sum of the maximum ON-state currents of the different devices. Please note that if the microprocessor ground and the device ground are separated then the voltage drop across the RGND (given by IS in ON state max * RGND) produce a difference between the generated input level and the IC input signal level. This voltage drop will vary depending on how many devices are ON in the case of several high side switches sharing the same RGND. Figure 8. Reverse polarity protection
+ Vcc Statusi Inputi GND Outputi
RGND (Optional)
Load
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Package mechanical data
VN808CM-32-E
8
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 10.
Dim. Min. A a1 a2 a3 b c D (1) D1 E E1 (1) E2 E3 e e3 G H h L N S 0 0.80 0 15.50 5.8 0.65 11.05 0.10 15.90 1.10 1.10 10 8 0 0.031 0.000 0.610 0 0.22 0.23 15.80 9.40 13.90 10.90 0.10 Typ. Max. 3.60 0.30 3.30 0.10 0.38 0.32 16.00 9.80 14.50 11.10 2.90 6.2 0.228 0.025 0.435 0.0039 0.6260 0.0433 0.0433 10 8 0 0.008 0.009 0.622 0.370 0.547 0.429 0.003 Min. Typ. Max. 0.1417 0.0118 0.1299 0.0039 0.0150 0.0126 0.6299 0.3858 0.5709 0.4370 0.1142 0.2441
PowerSO-36 mechanical data
mm inch
14/18
VN808CM-32-E Figure 9. PowerSO-36 drawings
Package mechanical data
Figure 10. PowerSO-36 footprint
15/18
Order codes
VN808CM-32-E
9
Order codes
Table 11. Order codes
Order codes VN808CM-32-E VN808CMTR-32-E Package PowerSO-36 PowerSO-36 Packaging Tube Tape and reel
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VN808CM-32-E
Revision history
10
Revision history
Table 12.
Date 28-Jun-2006 07-Aug-2008
Document revision history
Revision 1 2 Initial release Added Section 7 on page 13, Figure 10: PowerSO-36 footprint on page 15 Changes
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VN808CM-32-E
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